Process-Shenzhen Dingji Electronics Co., Ltd

Number of Layers 层次	Rigid PCB 刚性板	1-32
	Flex-rigid PCB 刚挠结合板	2-16
	HDI 高密度互连	2+n+2
Materials 材料	FR4 ( Shengyi )	yes
	混压板	Yes
	High Tg 高 Tg	Tg-220
	EHalongen Free 无卤素	yes
	High Frequency 高频	yes
Maximum board size 最大成品尺寸		600*500MM
Board thickness 板厚		0.21-4.0mm
Minimum line width 最小线宽		3mil-inner 局部可以做 2.4MIL 3mil-outer 局部可以做 2.4MIL
Minimum Line gap 最小线距		2.8mil-inner 局部可以做 2.4MIL 2.8mil-outer 局部可以做 2.4MIL
Outer layer copper thickness 外层最大铜厚		7OZ
Inner layer copper thickness 内层最大铜厚		7OZ
Min. finished hole size (Mechanical) 最小成品孔径（机械孔）	0.10mm	板厚小于 0.80MM 的可以做 0.10MM 的通孔，板厚小于 1.20MM 板厚的可以做 0.15MM 的通孔
Min. finished hole size (laser hole) 最小成品孔径（激光孔）	0.1mm	yes
Aspect ratio 最大板厚孔径比率		12：1
Solder Mask Types and brand 阻焊类型和品牌	NAYA(LP-4G)	yes
	KSM	yes
	TAIYO(PSR2200)	yes
Solder Mask Color 阻焊油墨颜色	green;blue;red;white;bla ck 绿、蓝、红、白、黑、其他	yes
Impedance Control Tolerance 阻抗控制公差	10%	极限可做 5%
Plug via hole 过孔塞孔	Min. size can be plugged	0.1mm
Plug via hole 过孔塞孔	Max. size can be plugged	0.50mm
Min. annular ring can be kept		3mil
Min. distance between the IC pads can keep SM bridge 最小IC 管距（可保留阻焊桥）		8mil
Min. SM bridge for green soldermask 最小阻焊桥（绿油）		3.2mil
Min. SM bridge for black soldermask 最小阻焊桥（黑油）		4.4mil
Surface Treatment 表面处理类型	HASL 喷锡	yes
	ENIG 沉金	yes
	OSP	yes
	LEAD FREE HASL 无铅喷锡	yes
	GOLD PLATING 镀金	yes
	IMMERSION Ag 沉银	yes
	IMMERSION Sn 沉锡	yes
V-Cut	CNC V-cut, degree	20\30\45\60
V-Cut	V-cut by hand, degree	20\30\45\60
Outline Profile 外形		CNC
Chamfer 圆角	The angle type of the chamfer:	20\30\45
Chamfer 圆角	Min. distance of jumping chamfer:	5mm
Tolerance of the dimension size 外形尺寸公差		±0.1mm
Tolerance of the board thickness 板厚公差	0.21---1.0	±0.1
	1.0--2.5	±7%
	2.5-6.3	±6%
Tolerance of the finished hole size 成品孔径公差	0-0.3	+0.08mm
	0.31---0.8mm	±0.08mm
	0.81-1.60mm	±0.05mm
	1.61-2.49mm	±0.75mm
	2.5-6.0mm	+0.15/-1mm
	>6.0mm	+0.3 /-1mm