5G high-density interconnect HDMI circuit board

Detailed product specifications for 5G high-density interconnect HDI circuit boards. These parameters mainly include the following aspects:

产品介绍

Detailed product specifications for 5G high-density interconnect HDI circuit boards. These parameters mainly include the following aspects:

1. Material: The substrate of 5G high-density interconnect HDI circuit boards is usually made of FR-4 or high TG materials, both of which have good electrical and mechanical properties.

2. Layers: HDI circuit boards typically have 6 to 30 layers, with 6 to 18 layers being the most common. The more layers there are, the greater the flexibility of its design.

3. Aperture: The aperture of HDI circuit boards is usually 0.1mm to 0.3mm, and the smaller the aperture, the higher the density.

4. Line width/line spacing: The line width/line spacing of HDI circuit boards is usually 0.05mm to 0.1mm. The smaller the line width/line spacing, the faster the signal transmission speed.

5. Surface treatment: The surface treatment of HDI circuit boards usually includes gold plating, silver plating, tin plating, OSP, etc. Different surface treatment methods have different performance and prices.

6. Impedance control: Impedance control of HDI circuit boards is very important because it directly affects the quality and speed of signal transmission.

7. Thermal design: Due to the large amount of data that 5G devices need to process, their heat generation is relatively high. Therefore, the thermal design of HDI circuit boards is also very important.

The above are the detailed parameters of 5G high-density interconnect HDI circuit boards. By understanding these parameters, we can better understand the performance and applications of HDI circuit boards, and thus better utilize them to improve the performance and reliability of our electronic devices.

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产品介绍

Detailed product specifications for 5G high-density interconnect HDI circuit boards. These parameters mainly include the following aspects:

1. Material: The substrate of 5G high-density interconnect HDI circuit boards is usually made of FR-4 or high TG materials, both of which have good electrical and mechanical properties.

2. Layers: HDI circuit boards typically have 6 to 30 layers, with 6 to 18 layers being the most common. The more layers there are, the greater the flexibility of its design.

3. Aperture: The aperture of HDI circuit boards is usually 0.1mm to 0.3mm, and the smaller the aperture, the higher the density.

4. Line width/line spacing: The line width/line spacing of HDI circuit boards is usually 0.05mm to 0.1mm. The smaller the line width/line spacing, the faster the signal transmission speed.

6. Impedance control: Impedance control of HDI circuit boards is very important because it directly affects the quality and speed of signal transmission.