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10-layer hdi circuit board processing

Introduction: This article will introduce the detailed parameters of 10-layer HDI board in detail, including its structure, performance, application fields, etc., to help readers fully understand the characteristics and advantages of this high-end circuit board.

10-layer hdi circuit board processing

Product Details

Let's take a look at the 10- layer HDI board. HDI ( High Density Interconnector ) is a circuit board made using microvia technology. A 10- layer HDI board means that there are 10 layers of circuits in the circuit board, and each layer is connected by microvias. The main features of this circuit board are small size, light weight, and fast signal transmission speed.

 

The detailed parameters of the 10- layer HDI board mainly include:

 

1. Material: Usually FR-4 or high-frequency materials are used, which have good electrical performance and stability.

2. Number of layers: 10 layers, each layer is connected by micro holes.

3. Pore diameter: The diameter of micropores is generally less than 50um .

4. Line width / line spacing: Line width / line spacing is generally less than 20um .

5. Impedance: Depending on the design requirements, the impedance can be between tens of ohms and hundreds of ohms.

6. Surface treatment: Surface treatment methods such as gold plating, silver plating, and tin spraying can be used to improve weldability and corrosion resistance.

 

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Product Details

Let's take a look at the 10- layer HDI board. HDI ( High Density Interconnector ) is a circuit board made using microvia technology. A 10- layer HDI board means that there are 10 layers of circuits in the circuit board, and each layer is connected by microvias. The main features of this circuit board are small size, light weight, and fast signal transmission speed.

 

The detailed parameters of the 10- layer HDI board mainly include:

 

1. Material: Usually FR-4 or high-frequency materials are used, which have good electrical performance and stability.

2. Number of layers: 10 layers, each layer is connected by micro holes.

3. Pore diameter: The diameter of micropores is generally less than 50um .

4. Line width / line spacing: Line width / line spacing is generally less than 20um .

5. Impedance: Depending on the design requirements, the impedance can be between tens of ohms and hundreds of ohms.

6. Surface treatment: Surface treatment methods such as gold plating, silver plating, and tin spraying can be used to improve weldability and corrosion resistance.

 

10-layer hdi circuit board processing
Introduction: This article will introduce the detailed parameters of 10-layer HDI board in detail, including its structure, performance, application fields, etc., to help readers fully understand the characteristics and advantages of this high-end circuit board.
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