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Multi layer soft hard composite board

In the field of electronic device manufacturing, multi-layer soft hard bonding board is a common material. It combines the mechanical strength of hard boards with the flexibility of soft boards, and is widely used in the internal and external structures of electronic products. So, what are the product parameters of multi-layer soft hard composite boards? This article will provide you with a detailed analysis.

Multi layer soft hard composite board

产品介绍

In the field of electronic device manufacturing, multi-layer soft hard bonding board is a common material. It combines the mechanical strength of hard boards with the flexibility of soft boards, and is widely used in the internal and external structures of electronic products. So, what are the product parameters of multi-layer soft hard composite boards? This article will provide you with a detailed analysis.

1. Material: The substrate of multi-layer soft hard bonding board is usually made of high-performance engineering plastics such as polyimide (PI) or epoxy resin (FR-4). These materials have good electrical properties and heat resistance, which can meet the high-frequency, high-speed, and high-temperature operation requirements of electronic devices.

2. Thickness: The thickness of multi-layer soft hard composite boards can be customized according to design requirements. Common thicknesses include 0.2mm, 0.3mm, 0.5mm, 1.0mm, 1.6mm, etc. The thicker the thickness, the stronger its mechanical strength and voltage resistance.

3. Hardness: The hardness of multi-layer soft hard composite boards can be adjusted by changing the thickness of the substrate and copper foil. Generally speaking, the higher the hardness, the stronger its ability to resist bending and stretching.

4. Heat resistance: The heat resistance of multi-layer soft hard bonding boards mainly depends on the heat resistance of the substrate. Common PI substrates can work stably in the temperature range of -200 ℃ to+300 ℃, while FR-4 substrates have higher heat resistance and can work stably in the temperature range of -40 ℃ to+180 ℃.

5. Electrical performance: The electrical performance of multi-layer soft hard composite boards mainly includes indicators such as dielectric constant, insulation resistance, and withstand voltage. These indicators directly affect the electrical performance and stability of electronic devices.

6. Other parameters: In addition to the key parameters mentioned above, multi-layer soft hard bonding boards also need to consider other factors, such as the dimensional accuracy of the board, surface treatment (such as gold plating, silver plating), aperture tolerance, etc.

Overall, the product parameters of multi-layer soft hard composite boards are multifaceted and need to be customized according to specific application requirements. As a professional manufacturer of multi-layer soft hard composite boards, we have rich experience and advanced equipment to provide you with high-quality products and excellent services.


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产品介绍

In the field of electronic device manufacturing, multi-layer soft hard bonding board is a common material. It combines the mechanical strength of hard boards with the flexibility of soft boards, and is widely used in the internal and external structures of electronic products. So, what are the product parameters of multi-layer soft hard composite boards? This article will provide you with a detailed analysis.

1. Material: The substrate of multi-layer soft hard bonding board is usually made of high-performance engineering plastics such as polyimide (PI) or epoxy resin (FR-4). These materials have good electrical properties and heat resistance, which can meet the high-frequency, high-speed, and high-temperature operation requirements of electronic devices.

2. Thickness: The thickness of multi-layer soft hard composite boards can be customized according to design requirements. Common thicknesses include 0.2mm, 0.3mm, 0.5mm, 1.0mm, 1.6mm, etc. The thicker the thickness, the stronger its mechanical strength and voltage resistance.

3. Hardness: The hardness of multi-layer soft hard composite boards can be adjusted by changing the thickness of the substrate and copper foil. Generally speaking, the higher the hardness, the stronger its ability to resist bending and stretching.

4. Heat resistance: The heat resistance of multi-layer soft hard bonding boards mainly depends on the heat resistance of the substrate. Common PI substrates can work stably in the temperature range of -200 ℃ to+300 ℃, while FR-4 substrates have higher heat resistance and can work stably in the temperature range of -40 ℃ to+180 ℃.

5. Electrical performance: The electrical performance of multi-layer soft hard composite boards mainly includes indicators such as dielectric constant, insulation resistance, and withstand voltage. These indicators directly affect the electrical performance and stability of electronic devices.

6. Other parameters: In addition to the key parameters mentioned above, multi-layer soft hard bonding boards also need to consider other factors, such as the dimensional accuracy of the board, surface treatment (such as gold plating, silver plating), aperture tolerance, etc.

Overall, the product parameters of multi-layer soft hard composite boards are multifaceted and need to be customized according to specific application requirements. As a professional manufacturer of multi-layer soft hard composite boards, we have rich experience and advanced equipment to provide you with high-quality products and excellent services.


Multi layer soft hard composite board
In the field of electronic device manufacturing, multi-layer soft hard bonding board is a common material. It combines the mechanical strength of hard boards with the flexibility of soft boards, and is widely used in the internal and external structures of electronic products. So, what are the product parameters of multi-layer soft hard composite boards? This article will provide you with a detailed analysis.
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