High end HDI soft hard combination board is a high-performance circuit board product that integrates the advantages of soft hard combination board, with higher signal transmission speed and lower signal loss. In electronic devices, the application of advanced HDI software and hardware combination boards is becoming increasingly widespread, such as smartphones, tablets, laptops, etc. So, what are the detailed parameters of the high-order HDI soft hard bonding board? Let's take a closer look below.
1. Size: The size of the high-end HDI soft hard composite board can be customized according to customer needs. Common sizes include 30x30mm, 40x40mm, 50x50mm, etc.
2. Thickness: The thickness of high-order HDI soft hard bonding boards is usually between 0.8mm-3.0mm, which can be adjusted according to the needs of circuit design.
3. Material: High grade HDI soft hard composite board is mainly made of FR-4 glass fiber reinforced epoxy resin material, which has good heat resistance and mechanical strength.
4. Electrical performance: The high-order HDI soft hard composite board has excellent electrical performance, with low dielectric constant, fast signal transmission speed, and low signal loss. In addition, it also has good insulation performance and electromagnetic interference resistance.
5. Aperture and Hole Wall: The aperture of high-order HDI soft hard composite boards is usually between 0.1mm-0.3mm, and the hole wall is smooth and free of burrs, which is conducive to improving the reliability and service life of the circuit board.
6. Surface treatment: Surface treatment techniques for advanced HDI soft hard bonding boards include gold, silver, nickel, tin, etc., which can improve the soldering performance and corrosion resistance of circuit boards.
7. Other characteristics: High order HDI soft hard bonding boards also have excellent thermal conductivity, good chemical corrosion resistance, excellent mechanical strength, and dimensional stability.
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