HDI blind buried hole soft hard bonding board is a high-end circuit board product that combines the advantages of soft hard bonding board, while having higher density and smaller aperture. This type of circuit board is widely used in high-end electronic products such as smartphones, tablets, laptops, etc.
The basic concept of HDI blind buried hole soft hard bonding plate is to combine the soft hard bonding plate with high-density interconnect (HDI) technology, achieving smaller aperture and higher line width/spacing. The design and manufacturing process of this circuit board requires high-precision equipment and technology, so its price is relatively high.
The main characteristics of HDI blind buried hole soft hard bonding plate include high density, small aperture, high line width/spacing, excellent electrical performance, and good mechanical performance. These characteristics make HDI blind buried hole soft hard bonding plates widely used in electronic devices.
The application fields of HDI blind buried hole soft hard combination board mainly include high-end electronic products such as smartphones, tablets, laptops, automotive electronics, medical equipment, etc. In these applications, HDI blind buried hole soft hard combination plates can provide higher signal transmission speed and better electromagnetic compatibility.
The product details parameters of HDI blind buried hole soft hard bonding board mainly include: board type, thickness, aperture, line width/spacing, number of layers, surface treatment, etc. These parameters can be customized according to customer needs to meet different application requirements.
1. Board type: HDI blind buried hole soft hard bonding board usually uses FR-4 or high-frequency materials as the substrate.
2. Thickness: The thickness of HDI blind buried hole soft hard bonding plate is usually between 0.2mm and 3.0mm.
3. Aperture: The aperture of HDI blind buried hole soft hard bonding plate is usually between 0.1mm and 0.3mm.
4. Line width/line spacing: The line width/line spacing of HDI blind buried hole soft hard bonding plates is usually between 0.1mm and 0.2mm.
5. Layers: The number of layers for HDI blind buried hole soft hard bonding plates is usually between 6 and 30 layers.
6. Surface treatment: The surface treatment of HDI blind buried hole soft hard bonding board usually includes gold plating, silver plating, tin spraying, etc.
Overall, HDI blind buried hole soft hard combination board is an efficient and high-performance circuit board product. Its high density, small aperture, high line width/spacing and other characteristics make it widely used in high-end electronic products. If you need to learn more about HDI blind buried hole soft hard bonding plates, please feel free to contact us at any time.
中文
QQ客服
