HDI high-density soft hard composite board is a circuit board manufactured using high-density interconnect technology (HDI), which has higher circuit density and smaller aperture, and can meet the high performance requirements of complex electronic devices for circuit boards. The following is a detailed parameter analysis of HDI high-density soft hard bonding board.
1. Size: The size of HDI high-density soft hard composite board is usually the standard size, such as 100mm x 100mm, 200mm x 200mm, etc., and non-standard sizes can also be customized according to customer needs.
2. Thickness: The thickness of HDI high-density soft hard bonding board is usually between 0.4mm and 3.0mm, and the specific thickness can be selected according to circuit design requirements and equipment space limitations.
3. Layers: HDI high-density soft hard composite board can have multiple layers such as single-layer, double-layer, four layer, six layer, etc. The more layers, the higher the flexibility of circuit design.
4. Aperture: The aperture of HDI high-density soft hard composite board is usually between 0.1mm and 0.3mm, and the smaller the aperture, the higher the precision of circuit design.
5. Electrical performance: The electrical performance of HDI high-density soft hard composite board mainly includes parameters such as impedance, capacitance, inductance, etc. These parameters can meet the performance requirements of different circuits through design optimization and process control.
6. Material: The material of HDI high-density soft hard bonding board is usually FR-4 or BT resin material, which has good insulation performance and mechanical strength, and can meet the long-term use needs of circuit boards.
7. Surface treatment: The surface treatment of HDI high-density soft hard bonding boards usually includes gold plating, silver plating, nickel plating, etc. These surface treatments can improve the conductivity and corrosion resistance of the circuit board.
8. Reliability: The reliability of HDI high-density soft hard bonding boards is mainly evaluated through methods such as wet heat testing, temperature cycling testing, salt spray testing, etc., to ensure the stability and reliability of the circuit board under various environmental conditions.
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